Photonic Integrated Circuits Conference: High speed photonic integrated receivers for 100G and above
source：laserfair.com
release：Johnny Lee
Time：2015-09-02
Abstract:
Integration of Photonics on chip is necessary to address the future demands of the datacenter.
The market demands for low cost, small footprint and low power require innovation in the design of the photonic components. To reduce power and to enable on-chip integration requires designs that enable minimal temperature variation of MUX/De-MUX for the wavelength control and management.
BB Photonics is developing a platform approach integrating low loss dielectrics into InP wafers for wavelength routing and functionality to enable mode matched devices that have a low thermal variation.
This unique approach reduces size, cost, adds functionality and enables high coupling to the passive waveguides from the III-V components that can then be integrated with Spot-size converters and high-speed waveguide devices.
The current work on 100GbE LR4 device integration will be discussed.
| 2 days, 6 themes, 30+ presentations |
Sales of PICs are soaring, with their deployment helping to boost the capacity of networks and data centres. To aid this industry, we are strengthening the relationships between the makers and the users of these integrated circuits by launching PIC International, a global conference dedicated to this industry.
Attendees at the inaugural PIC International conference will hear industry-leading insiders delivering more than 30 presentations spanning six sectors.
PIC International provides comprehensive coverage of all aspects of this industry, from basic research to materials, equipment, packaging, and the incorporation of chips in data centres and optical networks. So whether you focus on system integration, developing and manufacturing components, financing this sector, or providing the materials and equipment needed to support this industry, PIC International is your must-attend conference for 2016.
PIC International will be co-located with the sixth CS International conference (Compound Semiconductor).
Presentations commited to date include:
| Aarhus University ArtIC Photonics Aurrion BB Photonics CEA-Leti CISCO Coriant Finisar Evans Analytical Group EV Group
|
Global Communication Semiconductors HP Huawei IBM Istituto Superiore Mario Boella JePPIX LioniX BV Luceda Photonics |
McGill University Mellanox Technologies Microsoft NTT Photonics Labs PhoeniX Software Politecnico di Milano Ranovus Smart Photonics TeraXion TU Eindhoven |
FISBA exhibits Customized Solutions for Minimally Invasive Medical Endoscopic Devices at COMPAMED in
New Active Alignment System for the Coupling of Photonic Structures to Fiber Arrays
A new industrial compression module by Amplitude
Menhir Photonics Introduces the MENHIR-1550 The Industry's First Turnkey Femtosecond Laser of
Shenzhen DNE Laser introduced new generation D-FAST cutting machine (12000 W)